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马斯克:SpaceX与特斯拉的Terafab芯片工厂计划2028年实现量产SpaceX and Tesla's Terafab targets 2028 for volume chip production, Musk says

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2023年6月16日,在法国巴黎凡尔赛门展览中心举行的专注创新与初创企业的“科技万岁”大会(Viva Technology)上,SpaceX和特斯拉首席执行官、X(前身为Twitter)所有者埃隆·马斯克挥手致意。路透社/Gonzalo Fuentes/资料照片Elon Musk, Chief Executive Officer of SpaceX and Tesla and owner of X, formerly known as Twitter, gestures as he attends the Viva Technology conference dedicated to innovation and startups at the Porte de Versailles exhibition centre in Paris, France, June 16, 2023. REUTERS/Gonzalo Fuentes/File Phot

SpaceX(SPCX.O)与特斯拉(TSLA.O)的芯片制造合资企业 Terafab 计划于 2028 年第三季度实现量产,埃隆·马斯克周二在 SpaceX 的电话会议上表示。

By Max A. Cherney The chip manufacturing joint venture between SpaceX (SPCX.O) and Tesla (TSLA.O) called Terafab aims to reach volume production by the third quarter of 2028, Elon Musk said on a SpaceX conference call on Tuesday.

“我对这个时间表留有很大的误差范围,因为我们不知道是否真的能实现,”马斯克在提到该时间表时说。

"I put big error bars on this because we don't know if we will actually achieve this or not," Musk said, referring to the timeline.

这一时间表是一个粗略的进度安排,该项目旨在按马斯克自己称为“非常激进”的进度,实现每年 1 太瓦面向 AI 和机器人技术的算力产能。在美国,建设尖端逻辑芯片工厂可能需要三年或更长时间。

The timeline is a rough schedule for a project that aims to produce 1 terawatt a year of computing power for AI and robotics, on a schedule Musk himself called "very aggressive." In the United States, cutting-edge logic factories can take three or more years to build.

马斯克曾描述,计划在德克萨斯州建设的综合体将把先进制造、封装和测试——涵盖先进逻辑芯片和存储芯片——结合在一个设施内。

Musk has described the planned complex in Texas as combining advanced manufacturing, packaging and testing of both advanced logic and memory chips in one facility.

周二,马斯克表示,在内部规划中,Terafab 目标是在明年 5 月或 6 月左右,让首颗采用静态随机存取存储器(SRAM)电路的测试芯片在位于奥斯汀的 Terafab 研究设施实现功能验证。

On Tuesday, Musk said that internally, Terafab aims to have a first test chip, using static random-access memory (SRAM) circuits, functional in roughly May or June of next year at the Terafab research facility in Austin.

芯片制造商通常会制造 SRAM 电路,作为完善制造工艺开发的一种手段。

Chip manufacturers commonly fabricate SRAM circuits as a method of refining manufacturing process development.

马斯克有设定时间表却未能兑现的历史。SpaceX 首席执行官将 Terafab 的时间表描述为公司的愿景,并称这些日期“非常激进”。

Musk has a history of setting timelines that his companies have missed. The SpaceX CEO described the Terafab timeline as the company's aspiration and said the dates are "very aggressive."

“就说吧,在 2028 年第三季度或第四季度实现量产,至少属于可能的结果之一,”马斯克说。“所以这些显然是芯片生产极其疯狂的时间框架。”在 SpaceX 的电话会议上,一位卖方分析师询问马斯克,SpaceX 是否已向唯一生产极紫外(EUV)光刻机的荷兰公司 ASML 下单。EUV 光刻机是生产英伟达(NVDA.O)和超威半导体(AMD.O)等最尖端芯片所必需的设备。

"Let's just say that outcome of achieving volume production is at least in the set of possible outcomes for Q3 or Q4 of '28," Musk said. "So these are obviously like insanely fast time frames for chip production." On the SpaceX conference call, a sell-side analyst asked Musk whether SpaceX had placed orders for the extreme ultraviolet (EUV) lithography machines produced only by the Dutch company ASML. The EUV machines are necessary to produce the most cutting-edge chips made by Nvidia (NVDA.O) and Advanced Micro Devices (AMD.O).

马斯克没有直接回答该问题,并表示:“现在这些是非常激进的日期,我们非常感激 ASML 和我们所有其他供应商加快设备交付,以实现这一结果。” Terafab 面临的挑战之一是从 ASML 或美国供应商(如应用材料公司 (AMAT.O) 和 KLA (KLAC.O))获取足够的复杂、昂贵的半导体制造设备。

Musk did not answer the question directly and said, "Now these were very aggressive dates, and we're very appreciative of ASML and all of our other suppliers in accelerating equipment deliveries in order to achieve this outcome." One of the challenges Terafab faces is acquiring enough of the complex, expensive semiconductor manufacturing equipment from ASML or American suppliers such as Applied Materials (AMAT.O) and KLA (KLAC.O).

英特尔 (INTC.O) 4 月表示将加入 Terafab 项目,以帮助加速 Terafab 的目标。英特尔还发布了一张 CEO 陈立武与马斯克握手的照片,称当月在其园区接待了世界首富。这些公司尚未透露合作在实践中将如何运作。

Intel (INTC.O) said in April that it would join the Terafab project to help accelerate Terafab's goals. Intel also posted a photo of CEO Lip-Bu Tan and Musk shaking hands, saying it hosted the world's richest man at its campus that month. The companies have not revealed how the collaboration would function in practice.

本月早些时候,马斯克表示曾就与台积电 (2330.TW)(全球最大的先进芯片制造商)的潜在合作进行过讨论。但马斯克后来表示,Terafab 致力于自行运营该工厂。

Earlier this month, Musk said there had been discussions about potential cooperation with Taiwan Semiconductor Manufacturing Company (2330.TW), the world's largest advanced chip manufacturer. But Musk later said Terafab is committed to running the facility itself.

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